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Fakultät BCI

28th DDIC Technical Committee Meeting in Karlsruhe

© FSV
On March 5, 2025, the 28th DDIC Technical Committee Meeting took place at the Process Automation World at Siemens in Karlsruhe.

The event featured insightful guest lectures on topics such as lab automation, digitalization, and sustainable solutions in the pharmaceutical industry, including eco-friendly blister packaging.

Mr Pech, a PhD student from the chair of solids process engineering, was invited to present about sustainable blister packaging. In his inspiring talk, he focused on actual characterization challenges using new blister materials. He presented novel analytical techniques as well as innovative modelling approaches.

To conclude the event, participants joined a facility tour at Siemens' Process Automation World, gaining deeper insights into their standardized machine-platform communication technology.

The meeting provided an excellent platform for networking, knowledge exchange, and discussions on the future of digital and sustainable innovations in process automation.